Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures

Chien, J.-H.J.-H.ChienYu, H.H.YuTsai, N.-Y.N.-Y.TsaiLung, C.-L.C.-L.LungHsu, C.-C.C.-C.HsuChou, Y.-F.Y.-F.ChouChen, P.-H.P.-H.ChenChang, S.-C.S.-C.ChangPING-HEI CHEN2018-09-102018-09-102012http://www.scopus.com/inward/record.url?eid=2-s2.0-84866856641&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/370770[SDGs]SDG7Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structuresjournal article10.1109/ECTC.2012.6249028