Efficient thermal simulation for 3-D IC with thermal through-silicon vias

Oh, D.D.OhChen, C.C.P.C.C.P.ChenHu, Y.H.Y.H.HuCHUNG-PING CHEN2020-06-112020-06-112012https://scholars.lib.ntu.edu.tw/handle/123456789/501064[SDGs]SDG7Efficient thermal simulation for 3-D IC with thermal through-silicon viasjournal article10.1109/TCAD.2012.21964352-s2.0-84867833985https://www.scopus.com/inward/record.uri?eid=2-s2.0-84867833985&doi=10.1109%2fTCAD.2012.2196435&partnerID=40&md5=43669e1948f8f85db68423664f349239