Does the Residual Stress of Backend Grinding Dominate the Warping Problems in Wafer Thinning Process

Chen, K.R.K.R.ChenYoung, H.T.H.T.YoungHONG-TSU YOUNG2021-11-222021-11-222010https://scholars.lib.ntu.edu.tw/handle/123456789/587666Does the Residual Stress of Backend Grinding Dominate the Warping Problems in Wafer Thinning Processjournal article