Thermal modeling for 3D-ICs with integrated microchannel cooling.

Mizunuma, HitoshiHitoshiMizunumaYang, Chia-LinChia-LinYangYI-CHANG LUCHIA-LIN YANG2020-05-042020-05-042009https://scholars.lib.ntu.edu.tw/handle/123456789/487777Thermal modeling for 3D-ICs with integrated microchannel cooling.conference paper10.1145/1687399.1687447https://doi.org/10.1145/1687399.1687447