Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates

Chiu, M.Y.M.Y.ChiuWang, S.S.S.S.WangChuang, T.H.T.H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122002https://scholars.lib.ntu.edu.tw/handle/123456789/492034Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substratesjournal article10.1007/s11664-002-0105-82-s2.0-0036575443https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036575443&doi=10.1007%2fs11664-002-0105-8&partnerID=40&md5=89c46c3a0754c14b2facbef33e429b62