A Comparative Molecular Dynamics Study of Copper Trench Fill Properties between Ta and Ti Barrier Layer

Yang, J. Y.J. Y.YangHong, R. T.R. T.HongHuang, M. J.M. J.Huang2008-10-282018-06-282008-10-282018-06-282005http://ntur.lib.ntu.edu.tw//handle/246246/85534application/pdf328066 bytesapplication/pdfen-USA Comparative Molecular Dynamics Study of Copper Trench Fill Properties between Ta and Ti Barrier Layerjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/85534/1/6.pdf