RUEY-BEEI WU2018-09-102018-09-101988-1100189480http://scholars.lib.ntu.edu.tw/handle/123456789/342475https://www.scopus.com/inward/record.uri?eid=2-s2.0-0024108226&doi=10.1109%2f22.8915&partnerID=40&md5=c2b4e5f0accf2070fb262df8a839bb96A novel approach is proposed to facilitate the capacitance calculations for periodic three-dimensional multiconductor systems. Based on the Fourier transform technique, the approach requires only the conductors inside one period and solves the charge distribution in the spectral domain by the integral equation method. The resultant spectral capacitances are then inverse transformed to give the capacitances between any two conductors, which may even be inside different periods. The approach is finally applied to the capacitance analysis for connector pins in a packaging board design. © 1988 IEEEELECTRIC WIRING; INTEGRATED CIRCUITS -- Electronics Packaging; MATHEMATICAL TECHNIQUES -- Integral Equations; MATHEMATICAL TRANSFORMATIONS -- Fourier Transforms; SPECTRUM ANALYSIS; CAPACITANCE CALCULATIONS; MULTICONDUCTOR TRANSMISSION LINES; PACKAGING BOARD DESIGN; PERIODIC STRUCTURES; THREE DIMENSIONAL MULTICONDUCTOR SYSTEMS; PRINTED CIRCUITSjournal article10.1109/22.89152-s2.0-0024108226WOS:A1988Q588200007