Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates

Chan, Y.C.Y.C.ChanChiu, M.Y.M.Y.ChiuChuang, T.H.T.H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122002https://scholars.lib.ntu.edu.tw/handle/123456789/492036Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substratesjournal article10.3139/146.0200952-s2.0-0036471978https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036471978&doi=10.3139%2f146.020095&partnerID=40&md5=7e6145b31e376a2ff82849af5341c48c