Characterization of Intermetallic Compounds formed during the Interfacial Reactions of Liquid Su and Sn-58Bi Solders with Ni Substrates

Chiu, M. Y.M. Y.ChiuChang, S. Y.S. Y.ChangTseng, Y. H.Y. H.TsengChan, Y. C.Y. C.ChanChuang, T. H.T. H.Chuang2009-01-062018-06-282009-01-062018-06-282002http://ntur.lib.ntu.edu.tw//handle/246246/95928en-USCharacterization of Intermetallic Compounds formed during the Interfacial Reactions of Liquid Su and Sn-58Bi Solders with Ni Substratesjournal article