Yang S.Hung H.T.Wu P.Y.Wang Y.W.Nishikawa H.C. ROBERT KAO2019-11-272019-11-27201800134651https://www.scopus.com/inward/record.uri?eid=2-s2.0-85053548055&doi=10.1149%2f2.0441807jes&partnerID=40&md5=f2b118dde7f8a7395673d7b990ce5de0https://scholars.lib.ntu.edu.tw/handle/123456789/432582Materials merging mechanism of microfluidic electroless interconnection processjournal article10.1149/2.0441807jes2-s2.0-85053548055