Yang, Y.-J.Y.-J.YangYu, C.-C.C.-C.YuYangYJ2008-11-052018-06-282008-11-052018-06-28200409601317http://ntur.lib.ntu.edu.tw//handle/246246/85999https://www.scopus.com/inward/record.uri?eid=2-s2.0-2342517503&doi=10.1088%2f0960-1317%2f14%2f4%2f020&partnerID=40&md5=c0cd174274cf840bb59901e7df08c24eIn this paper, a model order reduction technique for MEMS heat-transfer system-level modeling is presented. A 3D heat-transfer solver, which is appropriate for MEMS thermal analysis, is implemented using the finite-difference method (FDM). The numerical models generated by the FDM solver can be reduced into low-order macromodels by an Arnoldi-based technique. This order reduction operation has been implemented as an automatic process. Because the macromodels are generated from the finite-element or the finite-difference (FEM/FDM) approximation of the original solid models, they preserve the original characteristics for most operation conditions. Also, since the orders of the macromodels are much less than those of their original FEM/FDM models, the computational costs are significantly reduced by about two to four orders of magnitude. This performance improvement thus makes the macromodels compatible for system-level or circuit simulations, which is essential for overall performance prediction. We also demonstrate that the macromodel results are in good agreement with the experimental results. The macromodels are also converted into the circuit component modules written by the hardware description language, and are inserted into a circuit simulator for system-level simulations with other circuit components.application/pdf352099 bytesapplication/pdfen-US[SDGs]SDG7Computational methods; Computer hardware description languages; Computer simulation; Feedback; Finite difference method; Finite element method; Heat transfer; Mathematical models; Resistors; Thermoanalysis; Circuit simulations; Macromodels; Subsystems; System level modeling; Microelectromechanical devicesExtraction of heat-transfer macromodels for MEMS Devicesjournal article10.1088/0960-1317/14/4/0202-s2.0-2342517503http://ntur.lib.ntu.edu.tw/bitstream/246246/85999/1/11.pdf