Optimizing the wire-bonding parameters for second bonds in ball grid array packages

Ho C.E.Chen C.C. ROBERT KAO2019-11-272019-11-27200002533839https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034266675&doi=10.1080%2f02533839.2000.9670583&partnerID=40&md5=bf03e72b905d2708ea04173074db0aa7https://scholars.lib.ntu.edu.tw/handle/123456789/432744Optimizing the wire-bonding parameters for second bonds in ball grid array packagesjournal article10.1080/02533839.2000.96705832-s2.0-0034266675