Twinning mechanism at three-grain tri-junction during directional solidification of multi-crystalline silicon

Jain, T.T.JainLin, H.K.H.K.LinLan, C.W.C.W.LanCHUNG-WEN LAN2020-01-062020-01-062018https://scholars.lib.ntu.edu.tw/handle/123456789/444831Twinning mechanism at three-grain tri-junction during directional solidification of multi-crystalline siliconjournal article10.1016/j.actamat.2017.10.0422-s2.0-85032275484https://www.scopus.com/inward/record.uri?eid=2-s2.0-85032275484&doi=10.1016%2fj.actamat.2017.10.042&partnerID=40&md5=951056ad492537378d0f5d3cdc3f47d1