Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints

Liu, Chao ShengChao ShengLiuHo, Cheng EnCheng EnHoPeng, Cheng SamCheng SamPengC. ROBERT KAO2012-10-242018-06-282012-10-242018-06-282011http://ntur.lib.ntu.edu.tw//handle/246246/243702en-USEffects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Jointsjournal article10.1007/s11664-011-1666-12-s2.0-80051585646http://ntur.lib.ntu.edu.tw/bitstream/246246/243702/-1/145.pdf