Chip Last Fan-Out Packaging for Millimeter Wave Application

Lu, H.-C.H.-C.LuWang, Y.-H.Y.-H.WangLeou, J.-L.J.-L.LeouChan, H.H.ChanChen, S.S.ChenHSIN-CHIA LU2020-06-162020-06-162016https://scholars.lib.ntu.edu.tw/handle/123456789/502215[SDGs]SDG7Chip Last Fan-Out Packaging for Millimeter Wave Applicationconference paper10.1109/ECTC.2016.1972-s2.0-84987829364https://www.scopus.com/inward/record.uri?eid=2-s2.0-84987829364&doi=10.1109%2fECTC.2016.197&partnerID=40&md5=70efb04504f57f91cb4ec6666a6e4070