Performance Comparison of Flip-Chip-Assembled 5-GHz 0.18-<formula formulatype="inline"> <tex Notation="TeX">$\\mu{\ m m}$</tex></formula> CMOS Power Amplifiers on Different Packaging Substrates

Che-Chung KuoYao-Wen HsuWei-Chao HuangHuei WangHSIN-CHIA LU2018-09-102018-09-102013http://scholars.lib.ntu.edu.tw/handle/123456789/378007Performance Comparison of Flip-Chip-Assembled 5-GHz 0.18-<formula formulatype="inline"> <tex Notation="TeX">$\\mu{\ m m}$</tex></formula> CMOS Power Amplifiers on Different Packaging Substratesjournal article10.1109/tcpmt.2013.2282295