Ko S.-C.Lee S.Hsueh C.-H.CHUN-HWAY HSUEH2019-09-252019-09-25200300218979https://scholars.lib.ntu.edu.tw/handle/123456789/424988An analytical model was developed to study the viscoelastic stress relaxation in film/substrate systems. The viscous flow was assumed to follow the Kelvin model, and the viscoelastic solution was obtained from existing elastic solution using Laplace transform. Results indicated that the stress relaxation rate increased with decreased film-to-substrate thickness ratio.journal article10.1063/1.15411082-s2.0-0037348070https://www2.scopus.com/inward/record.uri?eid=2-s2.0-0037348070&doi=10.1063%2f1.1541108&partnerID=40&md5=bdd65cd402643c2d670eb0d5a5333f71