Wu K.-HHSI-TSENG CHOULin D.-BYang C.-SChou C.-WPan C.-LLin C.-TLin J.-CFang L.-CIvashina M.2023-06-092023-06-0920215695503https://www.scopus.com/inward/record.uri?eid=2-s2.0-85124656182&doi=10.1109%2fECTC32696.2021.00190&partnerID=40&md5=16b77f4f630c0a03b56b1f12b0e58b81https://scholars.lib.ntu.edu.tw/handle/123456789/632505Antenna-in-Package/Module (AiP/AiM) are the primary technologies to realize the RF subsystems for frequencies beyond millimeter-wave (mmW) bands, including sub-terahertz for potential B5G/6G applications. Due to the small wavelength, the mechanical process of the current system-in-package (SiP) results in limitations to realize antenna arrays at sub-terahertz. In this paper, the mechanical limits to cause radiation discrepancy is investigated by designing an AiP/AiM at 110 GHz band. Through the parametric studies based on the currently available cheap SiP process, one may summarize the considerations of AiP/AiM design for beyond sub-terahertz frequencies. The examination will consider the design of an 8x8 antenna array to provide a radiation gain of 20 dBi. Numerical full-wave simulations by HFSS were performed to obtain reliable behaviors of AiP/AiM radiations. © 2021 IEEEActive antenna; Antenna array; Antenna-in-module; Antenna-in-package; B5G/6G mobile communication; Sub-Terahertz frequencies[SDGs]SDG7Antenna arrays; Microwave antennas; Millimeter waves; Silicon compounds; Terahertz waves; Active antennas; Antenna in packages; Antenna-in-module; B5G/6g mobile communication; Mobile communications; Primary technologies; Sub-terahertz; Sub-terahertz frequency; Systems in packages; Terahertz frequencies; System-in-packageconference paper10.1109/ECTC32696.2021.001902-s2.0-85124656182