Novel method to investigate the critical depth of cut of ground silicon wafer

Young, H.T.H.T.YoungLiao, H.-T.H.-T.LiaoHuang, H.-Y.H.-Y.HuangHONG-TSU YOUNG2018-09-102018-09-102007http://www.scopus.com/inward/record.url?eid=2-s2.0-33750634167&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/330561Novel method to investigate the critical depth of cut of ground silicon waferjournal article10.1016/j.jmatprotec.2006.07.025