Overview of power integrity solutions on package and PCB: decoupling and EBG isolation

T.-L. WuH.-H. ChuangT.-K. WangWu, Tzong-LinTzong-LinWu2018-09-102018-09-102010-05http://scholars.lib.ntu.edu.tw/handle/123456789/359405[SDGs]SDG7Overview of power integrity solutions on package and PCB: decoupling and EBG isolationjournal article10.1109/TEMC.2009.20395752-s2.0-77952744843WOS:000277881800009