Te-Yen ChiuYu-Ling LeeChun-Lin KoSheng-Hsiang TsengCHUN-HSING LI2020-08-052020-08-052020https://www.scopus.com/inward/record.uri?eid=2-s2.0-85094216955&doi=10.1109%2fIMS30576.2020.9224046&partnerID=40&md5=89f9ba506f8287d49e4296936a1742e2An interconnect for THz heterogeneous integration is proposed in this work. Two transmission lines deployed on a 40-nm CMOS chip and an IPD carrier, respectively, are coupled together to form a Marchand balun during a flip-chip packaging process. By doing this, the proposed interconnect can provide packaging and balun functions simultaneously. Two interconnects using the proposed idea are demonstrated with measured and simulated insertion loss of 0.9 and 1.4 dB at 169 and 340 GHz, respectively. © 2020 IEEE.Heterogeneous integration; Interconnect; Low-loss; Marchand balun; THzChip scale packages; CMOS chips; Flip-chip packaging; Heterogeneous integration; Heterogeneous systems; Low-loss; Marchand balun; Integrated circuit interconnectsconference paper10.1109/IMS30576.2020.92240462-s2.0-85094216955