Hsu, H.-J.H.-J.HsuHuang, J.-T.J.-T.HuangChao, P.-S.P.-S.ChaoWu, C.-S.C.-S.WuShih, S.-H.S.-H.ShihYang, S.-Y.S.-Y.YangSEN-YEU YANG2020-01-132020-01-132006https://scholars.lib.ntu.edu.tw/handle/123456789/448193Singular uniformity after reflow of varied-shaped flip chip solder bump on single substrateconference paper10.1109/EMAP.2006.44306082-s2.0-51449119833https://www.scopus.com/inward/record.uri?eid=2-s2.0-51449119833&doi=10.1109%2fEMAP.2006.4430608&partnerID=40&md5=064153e9b24dea55e0fb9d3bb69daf7a