Study of Sintered Nano-Silver Die Attachment Materials Doped with Indium

Yang C.A.C. ROBERT KAO2019-11-272019-11-272016978150901203905695503https://www.scopus.com/inward/record.uri?eid=2-s2.0-84987809899&doi=10.1109%2fECTC.2016.71&partnerID=40&md5=70deb5325bc3977d9b5c34a69c375c6dhttps://scholars.lib.ntu.edu.tw/handle/123456789/432593[SDGs]SDG9Study of Sintered Nano-Silver Die Attachment Materials Doped with Indiumconference paper10.1109/ECTC.2016.712-s2.0-84987809899