Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish

Jain, Chao-ChiChao-ChiJainWang, Shiuan-ShengShiuan-ShengWangWu, Hui-MinHui-MinWuChuang, Tung-HanTung-HanChuang2009-01-062018-06-282009-01-062018-06-282008http://ntur.lib.ntu.edu.tw//handle/246246/95974application/pdf1188014 bytesapplication/pdfen-USIntermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finishjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95974/1/116.pdf