Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish

Liu C.M.Ho C.E.Chen W.T.C. ROBERT KAO2019-11-272019-11-27200103615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035454941&doi=10.1007%2fs11664-001-0143-7&partnerID=40&md5=feab93819cb755559cd08883f276d0d4https://scholars.lib.ntu.edu.tw/handle/123456789/432742Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finishjournal article10.1007/s11664-001-0143-72-s2.0-0035454941