2015-08-012024-05-18https://scholars.lib.ntu.edu.tw/handle/123456789/696891摘要：本計畫將研發「應用於下世代行動通訊之射頻前端電路與模組技術」，整合砷化鎵化合物半導體積體電路製程之晶片設計與系統構裝技術，期能建立國內自行研發38 GHz射頻前端電路模組技術能力，並應用於下世代行動通訊實驗平台中。整合計畫中包含三個子計畫，共有兩位台灣大學、一位台灣師範大學與一位中正大學的教授參與。三個子計畫分別負責晶片構裝模組、功率放大器晶片、低雜訊放大器與收發切換開關之設計與開發。計畫將以三年的時間，完成功率放大器、低雜訊放大器與收發切換開關等模組，並提供建立國內下世代行動通訊實驗平台。此實驗平台的建立，將有助於國內對於未來高速行動通訊各項研究的進行。<br> Abstract: In this “RF Front-end Circuit and Module Techniques for Next Generation Mobile Communication” project, we will integrate the GaAs compound semiconductor integrated circuit (IC) design and the packaging technologies to develop the 38-GHz radio-frequency front-end circuit module for the next generation mobile communication experimental platform. This group research project consists of three sub-projects, and the members of this research team includes two professors from National Taiwan University, one professor from National Taiwan Normal University and one professor form National Chung Cheng University. The three sub-projects will develop the packaging module, power amplifier IC, low-noise amplifier and transmit/receive (T/R) switch ICs, respectively. The power amplifier, low-noise amplifier and T/R switch modules will be developed for the next-generation mobile communication experimental platform. The platform will be provided for the research works of the future high-speed mobile communication in Taiwan.毫米波砷化鎵相位陣列功率放大器低雜訊放大器收發切換開關millimeter-waveGaAsphased arraypower amplifierlow-noise amplifiertransmit/receive switch