2019-01-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/694475摘要：隨著行動裝置與物聯網的普及，開發微電子的省電裝置元件，也變得越來越重要。美商英特爾已經在去年推出了14 奈米FinFET元件，台灣積體電路公司與三星電子也會分別在今年推出16 奈米和14 奈米FinFET元件代工服務。由此可見FinFET元件已經是主流，然而隨著元件的尺寸不段的微縮，也有許多新的重要議題產生，例如: 在近一年中，陸陸續續有許多電子元件晶片，產生過熱的問題 (圖一)，進而影響整體元件的效能與可靠度，國際高通公司的晶片驍龍810，原本被寄予厚望，不料產生過熱的問題，進而影響相關手機出廠的進度，更流失許多寶貴的機會。而近日最熱門的新聞是: 蘋果公司iPhone 6s 中的晶片們事件，部份的蘋果迷運用程式發現，由三星電子所代工的A9晶片不論在耗電量與熱度上均明顯比我國台灣積體電路公司的晶片遜色。可見熱問題的處理在細小半導體元件中，所佔的重要性。 <br> Abstract: Due to the requirement of the mobile device and the development of the internet of thing (IOT) in the recent years, the advanced semiconductor device with the low power operation is needed urgently. Following the Moore’s law, the international company such as Intel, Samsung, and TSMC has successfully developed the 14/16 nm technology node product in recent two years. With the continuous device dimension scaling, how to reduce the device operated temperature becomes the big issue. The higher operated temperature in the device will result in the device performance degradation and reliability issues. As we known, the Snapdragon 810 chip from Qualcomm and the A9 chip made from Samsung both suffer this important issues (Fig. 1).自熱效應Self-Heating EffectSi