Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics

Chen Y.J.Chung C.K.Yang C.R.C. ROBERT KAO2019-11-272019-11-27201300262714https://www.scopus.com/inward/record.uri?eid=2-s2.0-84872098975&doi=10.1016%2fj.microrel.2012.06.116&partnerID=40&md5=4b76c46ff89f645cd5544205b9a8b653https://scholars.lib.ntu.edu.tw/handle/123456789/432632Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallicsjournal article10.1016/j.microrel.2012.06.1162-s2.0-84872098975