2016-06-092024-05-15https://scholars.lib.ntu.edu.tw/handle/123456789/665568摘要：為因應新世代產品應用演變更具功能性、輕便性、可靠度、節能化與低價化，以噴印製成為導體佈線技藝，取代半導體製程是未來主要技術趨勢。而利用奈米金屬導體的導電與低熔點特性應用在電子產品上已成為近年來的研究方向，使這些電子產品得以發揮作用的幕後功臣是在其中含細微電路的印刷電路板。在印刷產業中，奈米銀墨水的技術發展已相當成熟，具有高導電度及抗氧化性，而銅金屬無論在導電性及導熱性上的表現皆與銀金屬相近，卻具備較低成本，因此未來銅墨水是取代銀奈米墨水的最佳選擇。但欲製備的銅線越細時(<100μm)，其附著力可能下降並產生毛邊，因此必須調整銅墨水的配方。銅墨水可透過添加黏著劑與分散劑之比例，以調整導電墨水之黏度，進而改善銅墨水與FR4基材之附著力。此計畫中 (1)測試何種溶劑適合應用於噴印製程中，(2)藉由分散劑提高奈米銅顆粒的懸浮時間且同時兼顧導電性，(3)調整銅墨水附著於FR4基板之黏著力。<br> Abstract: To achieve progress of a new generation of product applications with more functionality, portability, reliability, energy conservation and cost reduction, inkjet printing techniques replacing semiconductor process technology is the future trend. The application of metal nanopowder as conductive metal wires has become a major research topic in recent years for its low melting point and high conductivity. The printed circuit board which contains fine circuits plays an important role in the electronic products. In the printing industry, the development of nano-silver ink technology is quite mature, because silver has a high conductivity and oxidation resistance. The performances in both electrical conductivity and thermal conductivity of copper are comparable to those of silver metal, but the cost of copper is much lower； therefore, nano silver ink can be replaced with nano-copper. When producing thinner copper wires ( <100μm), the problems of decreased adhesive force and rough edges of metal line will be encountered, so that the formula of the copper ink has to be adjusted. We propose that by the proper choice and addition of various adhesives and dispersants to adjust the viscosity, the adhesive force between the ink and the substrate can be improved. The research work in this project includes (1) Testing different solvents so that the copper ink can pass through the process of inkjet printing without jamming,(2) using dispersant to improve the nano copper particles suspended time and electrical conductivity of conductive metal wires.(3) looking for polymers which can be used to improve the adhesion force in the copper ink.nano copper particlesinkjet inkprinted circuit奈米銅粒子噴墨墨水印刷電路