Lee, H.-C.H.-C.LeeYAO-WEN CHANG2018-09-102018-09-102012http://www.scopus.com/inward/record.url?eid=2-s2.0-84863543753&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/372710A chip-package-board co-design methodologyconference paper10.1145/2228360.22285572-s2.0-84863543753