Intermetallic compounds formed during diffusion soldering of Au/Cu/Al <inf>2</inf>O<inf>3</inf> and Cu/Ti/Si with Sn/In interlayer

Chuang, T.-H.T.-H.ChuangLin, H.-J.H.-J.LinTsao, C.-W.C.-W.TsaoTUNG-HAN CHUANG2020-05-122020-05-122006https://scholars.lib.ntu.edu.tw/handle/123456789/492013Intermetallic compounds formed during diffusion soldering of Au/Cu/Al <inf>2</inf>O<inf>3</inf> and Cu/Ti/Si with Sn/In interlayerjournal article10.1007/s11664-006-0150-92-s2.0-33746925196https://www.scopus.com/inward/record.uri?eid=2-s2.0-33746925196&doi=10.1007%2fs11664-006-0150-9&partnerID=40&md5=2bc3c0dbbdf09e2cc0e0e0a16cd1c5df