Cheng, M.D.M.D.ChengYen, S.F.S.F.YenYen, S.F.S.F.YenChuang, T.H.T.H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122004https://scholars.lib.ntu.edu.tw/handle/123456789/492020Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packagesjournal article10.1007/s11664-004-0176-92-s2.0-1842584333https://www.scopus.com/inward/record.uri?eid=2-s2.0-1842584333&doi=10.1007%2fs11664-004-0176-9&partnerID=40&md5=78442b7a99f4309ba144e86602947a87