Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish

Ho C.E.Zheng R.Luo G.L.Lin A.H.C. ROBERT KAO2019-11-272019-11-27200003615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034295436&doi=10.1007%2fs11664-000-0010-y&partnerID=40&md5=8c6a57a06158fc9d48d529375de7fa8dhttps://scholars.lib.ntu.edu.tw/handle/123456789/432745Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finishjournal article10.1007/s11664-000-0010-y2-s2.0-0034295436