莊正民臺灣大學：國際企業學研究所Cho, Ming-KingMing-KingCho2007-11-282018-06-292007-11-282018-06-292004http://ntur.lib.ntu.edu.tw//handle/246246/60194半導體產業具有資本密集與高度技術的特性，而近年來在競爭激烈的國際市場中，全球各大半導體公司,為了快速取得先進製程技術與產能,紛紛採行併購或者策略聯盟的方式,以掌握商機。本文以飛利浦半導體公司、意法半導體公司和摩托羅拉半導體公司與台積電的策略聯盟為例，探討半導體產業策略聯盟的形成、執行與管理。策略聯盟合作夥伴可利用台積電的製程技術和晶圓產能開發新產品﹐台積電則可透過NextSys 平台與更多國內外客戶合作﹐創造雙贏局面。Semiconductor industry has been known for its capital and technology intensive characteristics as well as global competition. Recently many companies in the industry carry out M&A as well as strategic alliance to access the advanced technology and manufacturing capacity for faster time-to-market. This study, exploring formation, implementation and management in semiconductor industry, is based on Crolles2: the strategic alliance of Philips, STMicro, Motorola, and TSMC. Paving the way to win-win scenario, partners of the alliance can use the technology and capacity of TSMC for their product development, while TSMC as the technology enabler can expand the NextSys platform to other customers.Table of Contents Page Acknowledgement ii Abstract iii List of Figures vi List of Tables viii Chapter 1. Introduction 1 1.1 Research Motivation 1 1.2 Research Objective 1 1.3 Research Methodology 1 Chapter 2. Literature Review 3 2.1 Changing Business Environment 3 2.2 New Vision & Revised Strategy 4 2.3 Competitive and Cooperative Organization 5 Chapter 3. Structural Analysis of Semiconductor Industry 6 3.1 Value chain of Semiconductor Industry 7 3.2 Philips Semiconductor Business Update 11 3.3 STMicro Business Update 12 3.4 Motorola Semiconductor Business Update 13 3.5 TSMC Business Update 14 Chapter 4. Semiconductor Industry Alliances 15 4.1 Standard alliance 15 4.1.1 RosettaNet 15 4.1.2 Bluetooth 16 4.1.3 CellularRAM 17 4.1.4 Betamax/VHS and Memory Stick/SD card 18 4.2 Business alliance 18 4.2.1 Altera – TSMC – ASE 19 4.2.2 Xilinx – UMC – SPIL 19 4.2.3 Cross-license 19 4.3 Focus and consolidation 20 4.3.1 Memory Focus 20 4.3.2 SOC Focus 21 4.4 Technology for Capacity 21 4.5 Crolles2 Alliance 23 Chapter 5. Crolles2 Alliance Formation, Implementation and Management 24 5.1 Partners Selection 24 5.2 Scope of Alliance 25 5.3 Team Building and Alliance Infrastructure 26 5.4 Performance measurement and Improvement 27 Chapter 6. Conclusions and Outlook 29 6.1 Academic Implications 29 6.2 Managerial Implications 30 6.3 Outlook 31 References 32 Appendix 33 Table A-1 Top 10 Fabless IC suppliers 33 Table A-2 2003 Flash market share 34 Figure A-1 Flash Technology Alliance 35 Figure A-2 Worldwide Bluetooth Alliances in year 2000 36 International partnership and joint ventures in the semiconductor industry, 1989-1996 371276685 bytesapplication/pdfen-US策略聯盟半導體strategic alliancesemiconductorthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/60194/1/ntu-93-R89724019-1.pdf