3-D transient analysis of TSV-induced substrate noise: Improved noise reduction in 3-D-ICs with incorporation of guarding structures

Lin, L.J.-H.L.J.-H.LinYIH-PENG CHIOU2018-09-102018-09-102014http://www.scopus.com/inward/record.url?eid=2-s2.0-84901491709&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/3870403-D transient analysis of TSV-induced substrate noise: Improved noise reduction in 3-D-ICs with incorporation of guarding structuresjournal article10.1109/LED.2014.2318301