Wang Y.W.Lin Y.W.Tu C.T.C. ROBERT KAO2019-11-272019-11-27200909258388https://www.scopus.com/inward/record.uri?eid=2-s2.0-67349083563&doi=10.1016%2fj.jallcom.2008.11.052&partnerID=40&md5=e3490373465c121ddfe91fe66a8421b4https://scholars.lib.ntu.edu.tw/handle/123456789/432679Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cujournal article10.1016/j.jallcom.2008.11.0522-s2.0-67349083563