A study on wafer thinning techniques with residual stress estimation

Young, H.-T.H.-T.YoungLin, C.-C.C.-C.LinChang, M.-T.M.-T.ChangLiao, H.-T.H.-T.LiaoHONG-TSU YOUNG2018-09-102018-09-102006http://www.scopus.com/inward/record.url?eid=2-s2.0-84908338144&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/322468A study on wafer thinning techniques with residual stress estimationconference paper