Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending test

Cheng, C.-Y.C.-Y.ChengZhan, C.-J.C.-J.ZhanChuang, T.-H.T.-H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122008https://scholars.lib.ntu.edu.tw/handle/123456789/492000Fatigue life evaluation of ball grid array packages with Sn-Ag-Cu and rare-earth addition solder under cyclic bending testconference paper10.1109/IMPACT.2008.47838232-s2.0-64049093359https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049093359&doi=10.1109%2fIMPACT.2008.4783823&partnerID=40&md5=2dac72f2b3e2ec23c4d0e34c835cb130