Tsai J.Y.C. ROBERT KAO2019-11-272019-11-272002078037682X9780780376823https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966628872&doi=10.1109%2fEMAP.2002.1188849&partnerID=40&md5=d28b7da69d469bb7b3d61e0b44392b84https://scholars.lib.ntu.edu.tw/handle/123456789/432731The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallizationconference paper10.1109/EMAP.2002.11888492-s2.0-84966628872