2002-08-012024-05-18https://scholars.lib.ntu.edu.tw/handle/123456789/712697摘要：本子計畫擬以三年時間，研究將毫米波元組件整合為電路系統時，所將面臨的部份適用性問題。包括被動元件製作誤差所造成的電磁效應、天線陣列單元對傳輸線造成的負載效應、半導體等有損基板或不規則基板剖面對傳輸線特性及天線特性的影響、微屏壁的封裝效應、連通柱、空橋、固定線的幾何靈敏度分析、有限接地面及有限基板對傳輸線及天線特性的影響、介質共振器特性分析。擬使用工業分析軟體及自行發展程式進行分析及模擬。根據分析結果選擇實用參數進行電路實作及量測，以驗證結果及實用性。自行發展軟體部份，擬針對各子題，分別使用積分方程式法、矩量法、模態匹配法、線法、張量格林函數等技巧，推導理論、建立模式、設計程式，並與工業軟體及實驗量測做比對。 本子計畫所研究的子題中，關於有損基板及有限基板部份的研究與子計畫一、二、三關於主動元件的研究有互相加強的作用。天線陣列單元對傳輸線造成的負載效應有助於子計畫五的研究。傳輸線製作誤差的研究、連通柱、空橋、固定線的幾何靈敏度分析有助於子計畫六的進一步分析。本子計畫的研究子題、研究方法及內容具有連貫性及一致性，個別子題能使參與的研究生獲得良好的訓練，研究成果對學術界及產業界都能有所<br> Abstract: During the three-year span of this subproject, we plan to study some compatibility issues when integrating millimeter wave components into circuits. These issues include the impact of manufacturing tolerances on electromagnetic characteristics, loading effects of antenna arrays on the transmission lines, effects of lossy semiconductor substrate or substrates with irregular profile on the transmission lines and antennas, packaging effect of microshield, sensitivity study on via, air bridge, and wire bonding, effects of finite ground plane and finite substrate on the transmission lines and antennas, properties of dielectric resonators. Analyses and simulations will be conducted using industrial packages and in-house softwares. Circuits will be implemented and tested based on the parameters extracted from analysis for verification. The in-house softwares will be developed based on integral equation approach, method of moments, mode-matching technique, method of lines, dyadic Green’s function, and so on, depending on the attributes of each individual topic. The accuracy will also be verified by comparing with the results from running industrial packages and performing measurements. The topics related to lossy substrates and finite substrates will complement subprojects 1, 2, and 3 which are related to active components. Those related to loading effects of antenna arrays on the transmission lines will enhance the contents of subproject 5. Those related to manufacturing tolerances of transmission lines, sensitivity study on via, air bridge, and wire bonding will be useful to subproject 6. The research topics, methodologies, and contents are closely related and consistent. All the participating graduate students will benefit from the training process. The research results will contribute to both the academics and the industries.毫米波元組件適用性製作誤差週期性結構負載效應有損基板不規則基板剖面微屏壁封裝效應連通柱空橋固定線靈敏度分析有限接地面有限基板介質共振器積分方程式法矩量法模態匹配法millimeter wave componentscompatibilitymanufacturing tolerancesperiodical structuresloading effectslossy substrateirregular profilemicroshieldpackaging effectviaair bridgewire bondingsensitivity studyfinite ground planefinite s