Quantitative reliability analysis of electronic packages in consideration of variability of model parameters

Wu, W.-F.W.-F.WuLin, Y.-Y.Y.-Y.LinYoung, H.-T.H.-T.YoungHONG-TSU YOUNG2018-09-102018-09-102005http://www.scopus.com/inward/record.url?eid=2-s2.0-33847326816&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/315014Quantitative reliability analysis of electronic packages in consideration of variability of model parametersconference paper