莊東漢2006-07-252018-06-282006-07-252018-06-282001http://ntur.lib.ntu.edu.tw//handle/246246/12392本計畫針對球格陣列構裝進行冷熱循環試驗，而計畫所針對的無鉛銲錫成分為Sn-3.5Ag、Sn-57Bi，並以Sn-37Pb 作為對照。而冷熱循環試驗是依照JEDEC STANDARD “JESD22-A104-B”的規範來進行，並在冷熱循環試驗後進行推球試驗，以瞭 解其接點強度的變化。結果發現，三種銲錫其接點強度均隨著循環次數的增加而下降，在各個不同循環次數下，Sn-3.5Ag 銲錫始終保持最高的強度，而最差的則為Sn-37Pb。破斷面金相方面，發現在經過1000 次的冷熱循環後，Sn-37Pb 及Sn-57Bi 銲錫接點破斷在介金屬中，而Sn-3.5Ag 銲錫則斷裂在銲錫內部。In this study, we do temperature cycling tests for BGA package. The lead-free solder in this study includes Sn-3.5Ag and Sn-57Bi comparable with Sn-37Pb. This test follows the JEDEC STANDARD “JESD22-A104-B” and then we process the ball shear test that we can understand the strength change of the joints. The result appears that the strength of these solders decrease by increasing the test cycles. In each different circles of test, the Sn-3.5Ag solder keep the highest strength and Sn-37Pb solder is the lowest one. After 1000 cycles, the morphology of the fractured surface find that the solder joints of Sn-37Pb and Sn-5Bi break up in the intermetallic compounds, but Sn-3.5Ag solder fractured in the solder after one thousand cycles .application/pdf189944 bytesapplication/pdfzh-TW國立臺灣大學材料科學與工程學研究所冷熱循環試驗無鉛銲錫JEDEC STANDARDtemperature cycling testslead-free solderreporthttp://ntur.lib.ntu.edu.tw/bitstream/246246/12392/1/892216E002056.pdf