Analysis of fatigue life of electronic package under thermal cycling condition by acceleration model

Hsu Y.Wu W.-F.Lu Y.-A.2019-07-242019-07-2420159780991057627https://www.scopus.com/inward/record.uri?eid=2-s2.0-84945181147&partnerID=40&md5=7a92614b4094874d54efd9d61462c14ehttps://scholars.lib.ntu.edu.tw/handle/123456789/414995Analysis of fatigue life of electronic package under thermal cycling condition by acceleration modelconference paper2-s2.0-84945181147