吳錫侃臺灣大學：機械工程學研究所黃盈翔Huang, Ying-HsiangYing-HsiangHuang2007-11-282018-06-282007-11-282018-06-282004http://ntur.lib.ntu.edu.tw//handle/246246/61585本實驗係利用紅外線快速加熱的特性，研究數種活性硬銲填料與Al2O3基材間之潤濕性與界面顯微組織的變化。實驗結果發現4.5Ti在氧化鋁基材上的潤濕性較1.9Ti佳，接觸角與時間的關係再現性優良，可以Ambrose公式對特性時間取適當的修正係數而達到良好之預測。界面顯微組織之觀察顯示，Ag-26.7Cu-4.5Ti(wt.%)界面處形成Ti3.3Cu2.7O界面層；而Ag-27.5Cu-1.9Ti(wt.%)則形成Ti3Cu3O與TiOx界面層，TiOx會在表面形成並阻礙填料吸收紅外線熱源的能力，故提升測試溫度無助於潤濕性的改善。本研究還針對Ti-15Cu-15Ni(wt.%)接合潤濕純度分別為95與99.5wt.%之氧化鋁基材，觀察填料中活性元素含量較高的情況下與不同純度的氧化鋁基板之間潤濕性與界面組織演化的差異，低純度氧化鋁所含雜質對潤濕性與界面組織不足以造成明顯的影響；又由於填料中Cu原子含量太少，填料熔點無法降低，故Ti-15Cu-15Ni填料與氧化鋁基材間潤濕性的表現較Ag-Cu-Ti填料差。本研究最後利用Ag-5Al(wt.%)填料潤濕純鈦與純銅基板。在純鈦基材系統中，持溫在850℃時界面為TiAl相，而持溫在900℃時界面有Ag2TiAl相存在，顯示Ag2TiAl相與900℃時潤濕性能大幅提升有關。在純銅基材中，Ag原子與Cu原子形成共晶組織使填料熔點降低，填料與基材反應激烈故潤濕性較佳。Dynamic wetting angle (DWA) and interface microstructure of Ag-Cu-Ti active brazing alloys on 95wt.% Al2O3 by infrared heating were investigated and analyzed in the study. Experimental results show that Ag-26.7Cu-4.5Ti (wt.%) has better wettability than Ag-27.5Cu-1.9Ti (wt.%) and the data between wetting angle and time is reproduced quite well which can be fitted by Ambrose equation with suitable corrected characteristic time.The microstructural observations show that the interface of Ag-26.7Cu-4.5Ti/Al2O3 forms Ti3.3Cu2.7O layer﹐and that of Ag-27.5Cu-1.9Ti/ Al2O3 forms Ti3Cu3O and TiOx layers. For the latter case﹐TiOx can also form on the melt filler’s surface and block the filler to absorb infrared heat which causes the wettability of Ag-27.5Cu-1.9Ti to be independent of brazing temperature.The DWA of Ti-15Cu-15Ni(wt.%) filler alloy on 95wt.% and 99.5wt.% Al2O3 substrates were also studied.The wettability and interface microstructure are affected mostly by the filler alloy due to its high active Ti content﹐but are not so much affected by the purity of Al2O3 substrate.Because of the Cu concentration in Ti-15Cu-15Ni alloy is not high enough, the melting point of Ti-15Cu-15Ni alloy does not decrease too much.This feature causes the wettability of Ti-15Cu-15Ni/Al2O3 is inferior to that of Ag-Cu-Ti/Al2O3. In this study﹐we also used Ag-5Al (wt.%) filler alloy to wet pure Ti and pure Cu substrates. In pure Ti substrate﹐the interface is TiAl phase at 850℃ and is Ag2TiAl phase at 900℃ with the latter having the superior wettability.In pure Cu substrate,Ag and Cu atoms can react severely to form hypereutectic structure to cause its melting point decrease and thus improve its wettability.目 錄 中文摘要……………………………………………...…………………..Ⅰ 英文摘要………………………………………………………………….Ⅱ 目錄………………………………………………………………………..Ⅲ 第一章 前言………………..…………………………………………..…1 1-1 紅外線接合製程特性..........................................................2 1-2 潤濕現像..........................................................................3 第二章 文獻回顧……………..………………………………………….7 2-1陶瓷的一般特性及運用...................................................7 2-1-1物理性質...........………………………………………………7 2-1-2機械性質………………………………………………...........8 2-1-3應用.......................................................................... .8 2-2金屬與陶瓷間潤濕角分析...................................................9 2-2-1液體的表面張力.............…………………………………10 2-2-2金屬/合金與陶瓷界面分析…………………………………13 2-2-3潤濕角分析………………………………….……………....14 2-3活性硬銲製程之回顧........................................................16 2-3-1硬銲填料所需具備之特性...........................................16 2-3-2硬銲接合之特性………………………….………..............16 2-3-3 紅外線硬銲接合製程特性.........................................17 2-4 CCD………………………………….….……………..............19 2-4-1操作原理………….………………………………...........20 2-4-2 MOS電容結構…………….……………………….....…….20 2-4-3圖素與CCD分類………..............................................20 2-4-4 CCD電荷傳遞效率與尺寸大小.........……………………22 第三章 實驗方法……………………..…………………………………31 3-1材料選擇.................…………………………………………….31 3-2潤濕角量測試片之準備....................................................32 3-2-1 Al2O3基材..............................................................32 3-3硬銲填料之選用與準備………………………………………….32 3-4紅外線加熱處理.......…………………………………………….33 3-4-1實驗設備……………………………………………………..33 3-4-2載台…………………………………………………..….......34 3-4-3動態潤濕角測試……………………………………………..35 3-4-4持溫時間之控制……………………………………………..35 3-5實驗分析之儀器......……………………………………………..35 3-5-1光學顯微鏡及掃瞄式電子顯微鏡..........………………...35 3-5-2 EPMA化學組成分析..................................................36 3-5-3 X-RAY繞射分析........................................................36 第四章使用兩種活性銀基填料/氧化鋁基板潤濕性之結果與討論.....................................................................……....42 4-1 動態潤濕角度實驗分析…..…………………………………....42 4-2 潤濕角度分析與討論.......................................................43 4-3 表面張力分析.................................................................45 4-4 XRD表層分析.................................................................50 4-5. 接合界面顯微組織.........................................................51 4-5-1Ag-27.5Cu-1.9Ti..........................................................51 4-5-2 Ag-26.7Cu-4.5Ti.........................................................53 4-6 界面層反應機構之探討..................................................55 4-7 不同純度氧化鋁基板之潤濕性與界面顯微組織之比較......61 4-7-1潤濕性比較.............................................................61 4-7-2顯微組織之比較......................................................62 4-7-3表面張力之分析......................................................63 4-8 結論...............................................................................64 第五章Ti-15Cu-15Ni填料於兩種不同純度氧化鋁基板之動態潤濕角量測與分析.............................................................…92 5-1 Al2O3基材準備........................……………………………….93 5-2硬銲填料.........................…………………………………..…93 5-3層狀界面組織……………….......................…………...............94 5-4實驗結果與討論..............................................................96 5-4-1 潤濕角分析及討論..................................................96 5-4-2 填料合金界面顯微組織之觀察................................98 5-4-3 反應潤濕現象的改善..............................................103 5-4-4 潤濕性分析與討論...................................................104 5-4-5 填料與基材銅鍍層XRD分析...................................105 5-5演化過程之分析............................................................... 105 5-6 Ag-Cu-Ti與Ti-15Cu-15Ni填料之比較..............................106 5-7 結論................................................................................107 第六章 利用銀基填料進行紅外線硬銲接合純銅與純鈦............129 6-1實驗方法...........................................................................129 6-1-1硬銲接合試片之準備...........................................129 6-1-2 填料製備............................................................129 6-1-3 製程參數之選擇.....................................................130 6-2合金接合性質評估............................................................130 6-2-1 鈦的銲接特性......................................................130 6-2-2 銅的銲接特性.....................................................132 6-3實驗結果與討論..............................................................132 6-3-1 潤濕角度分析........................................................132 6-3-2 界面顯微組織之分析..............................................134 6-4 結論................................................................................137 第七章 結論…………………………………………………..………..155 參考文獻………………………………………………………………...1602856699 bytesapplication/pdfen-USAg-Cu-Ti動態潤濕性界面顯微組織活性硬銲填料Ti-15Cu-15NiAg-5AlActive brazing alloysInterface microstructureDthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/61585/1/ntu-93-R91522726-1.pdf