2012-08-012024-05-15https://scholars.lib.ntu.edu.tw/handle/123456789/664877摘要：在現今工業界中，微奈米科技已經日漸成長，因此細微元件之自動化光學檢測(AOI)設備需求 量也越來越大，錫凸塊(solder bumps)、金凸塊(golden bumps)的高度或共面度檢測、晶圓量測、PCB錫膏檢測與IC製程等檢測工程，此等細微元件之形貌量測技術皆須達到自動化大面積之線上高速檢測能力，以達成半導體產業所企求之高速全檢水準。由於目前市面上仍缺乏此等設備，且有鑑於目前傳統光學共焦或白光干涉之量測速度不足，無法滿足線上製程之嚴峻量測需求，除了量測效率不佳外，同時其精確性易遭受線上量測環境振動的干擾而下降。因此，本計畫擬發展IC封測顯微自動化光學檢測設備與關鍵技術，藉由所提出之創新式光學檢測架構(線上高速彩色共焦量測裝置與方法，已發展包括9項國內外發明專利佈局)，可發展成為一項IC封測顯維元件之形狀完整性與高度共面度檢測機台。本計劃預定在100μm之深度檢測範圍，其深度量測重覆度可達200 nm以內，檢測速度可達40 mm/s (FOV 7.0 x 30000 微米)。主要預期效益在未來於台大建立一個高科技製程檢測設備之研發團隊，在3-5年內使本校在此技術領域獲得在國家級之領先地位，並在5-10年內獲得國際級之實力與肯定。<br> Abstract: Three-dimensional shape reconstruction and inspection systems are extremely important techniques and devices for the development of automatic optical inspection (AOI) technologies in Taiwan, especially for semiconductor industries. To Taiwan, the AOI technology for ensuing dimensional quality of wafer surfaces, solder or golden bumps used in in-situ semiconductor IC packaging industries has become extremely important for enhancing strong competiveness internationally. Thus, with this respect, we aim to develop an in-situ innovative optical surface measuring instrument and key technologies for high-speed accurate optical dimensional measurement in this project. An innovative in-situ 3-D surface profilometer for inspecting micro surface profiles with a long vertical range and high resolution is proposed and developed by using innovative slit-scan multi-wavelength confocal surface profilometry. In conventional confocal microscopy, vertical scanning of a tested surface by either stage depth movement or shifting of optical objectives is of time consuming, thus making unacceptable measurement efficiency for in-situ inspection. To overcome this, in the research, a novel multi-wavelength confocal system employing a broad band light source in combination with a chromatic dispersion objective was developed to generate an accurate wavelength-to-depth conversion for in-situ 3-D profile measurement on wafer surfaces or other microstructures. The specially designed objective is capable of modulating a broadband light to produce axial chromatic dispersion with respect to a corresponding series of axial focusing depths along the vertical-axis and then to obtain the corresponding reflected light spectrum from the object’s surface. By designing the objective, the depth measurement range can be ranged between few to several hundred micrometers and the depth measurement resolution can theoretically reach to 0.03% of the overall detection range. It is expected that the maximum measurement error and repeatability can be controlled well within 0.099% of the overall measurement range and 200 nm in three standard deviations, respectively, while the measuring can reach up to 40 mm/s (FOV 7.0 x 30000 micrometers). By integrating a high-speed image acquisition unit, the measurement efficiency can be further enhanced for in-situ automatic optical inspection (AOI). Meanwhile, the developed system can be also applied for different application fields, including high accuracy measurement of solder pastes, BGA balls and microchips in semiconductor industries as well as other application fields such as 3-D vision for intelligent robots and vehicle safety surveillance.自動化光學檢測(AOI)晶圓量測光學檢測自動化光機電系統整合Automatic optical inspection (AOI)Automationsemiconductor wafer measurementOpto-mechatronicsIn-situ optical measurement.