Effect of parametric randomness on reliability analysis of wafer-level chip-scale packages

Wu W.-F.Hsu T.-K.Su C.-Y.Chen Y.-C.Yao H.2019-07-242019-07-2420089781424436217https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049117959&doi=10.1109%2fEMAP.2008.4784287&partnerID=40&md5=9c75cd6883b4c640ceb235e83c684de8https://scholars.lib.ntu.edu.tw/handle/123456789/415025Effect of parametric randomness on reliability analysis of wafer-level chip-scale packagesconference paper10.1109/EMAP.2008.47842872-s2.0-64049117959