In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing

Tsai, C.M.C.M.TsaiLai, Yi-ShaoYi-ShaoLaiLin, Y.L.Y.L.LinChang, C.W.C.W.ChangKao, C.R.C.R.Kao2008-12-312018-06-282008-12-312018-06-282006http://ntur.lib.ntu.edu.tw//handle/246246/95479application/pdf439466 bytesapplication/pdfen-USIn-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressingjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95479/1/02.pdf