Origin and evolution of voids in electroless Ni during soldering reaction

Chung C.K.Chen Y.J.Chen W.M.C. ROBERT KAO2019-11-272019-11-27201213596454https://www.scopus.com/inward/record.uri?eid=2-s2.0-84862805862&doi=10.1016%2fj.actamat.2012.02.018&partnerID=40&md5=de70e87230b082b5f2cc8094e6ddd74ahttps://scholars.lib.ntu.edu.tw/handle/123456789/432637Origin and evolution of voids in electroless Ni during soldering reactionjournal article10.1016/j.actamat.2012.02.0182-s2.0-84862805862