Li C.-H.Chiu Y.-F.Yu Y.-H.Chen J.-Z.JIAN-ZHANG CHEN2019-09-262019-09-2620159781467383561https://scholars.lib.ntu.edu.tw/handle/123456789/425262We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated. ? 2015 IEEE.conference paper10.1109/IMPACT.2015.73652332-s2.0-84964290549https://www2.scopus.com/inward/record.uri?eid=2-s2.0-84964290549&doi=10.1109%2fIMPACT.2015.7365233&partnerID=40&md5=d2f9b508a1155257bb9336cf153f5c5d