Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint

Yang C.A.Kao C.R.Nishikawa H.C. ROBERT KAO2019-11-272019-11-272017978150904332305695503https://www.scopus.com/inward/record.uri?eid=2-s2.0-85028065830&doi=10.1109%2fECTC.2017.78&partnerID=40&md5=074d13ff852c0e2d18d9dd56ab0ce604https://scholars.lib.ntu.edu.tw/handle/123456789/432585Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Jointconference paper10.1109/ECTC.2017.782-s2.0-85028065830